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Fundamental Aspects of Ultrathin Dielectrics on Si-based Devices Förderungs- und Betriebs GmbH 8 % der gesamtwirtschaftlichen Investitionen

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8 % der gesamtwirtschaftlichen Investitionen (siehe Anhang 1-1)

deren Verfahren gegen deutsche Soldaten und die Verhältnisse in der Strafanstalt Mitrowitza

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Fundamental Aspects of Ultrathin Dielectrics on Si-based Devices Förderungs- und Betriebs GmbH 8 % der gesamtwirtschaftlichen InvestitionenAn extrapolation of ULSI scaling trends indicates that minimum feature sizes below 0. 1 mu and gate thicknesses of <3 nm will be required in the near future. Given the importance of ultrathin gate dielectrics, well focused basic scientific research and aggressive development programs must continue on the silicon oxide, oxynitride, and high K materials on silicon systems, especially in the critical, ultrathin 1 3 nm regime. The main thrust of the

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